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The 1st Academic Conference on Semiconductor Equipment was successfully held in Tianjin from August 19 to 22, 2026. Hosted by the Chinese Mechanical Engineering Society (CMES), the conference was co-organized by the Semiconductor Equipment Branch of CMES, Tsinghua University, and Hwatsing Technology Co., Ltd.

With the theme of “Strengthening Equipment with Joint Efforts of Industry and Academia, Empowering the Future with Integrated Chip Intelligence”, the conference gathered more than 400 experts, scholars and industry leaders from across the country. It featured plenary speeches, invited industrial expert reports, parallel-session presentations, poster exhibitions and other diversified exchange activities. The conference covered key research and industrial development fields, including material manufacturing equipment, wafer manufacturing equipment, metrology equipment, packaging and testing equipment, components and materials, intelligent equipment and cutting-edge technologies, as well as talent cultivation through integration of industry and education, building an efficient platform for academic exchanges, technical discussions and industrial docking in China’s semiconductor equipment industry.

China Star provided full PCO service for the Conference.